Core semiconductor manufacturing processes—such as etching, thin-film deposition, lithography, and precision inspection—involve equipment operating in harsh environments characterized by ultra-high vacuum (UHV), wide-range temperature cycling, micro-vibration friction, and high-frequency electrical loads. These conditions impose extremely stringent requirements on cable cleanliness, electrical stability, mechanical durability, and temperature compatibility. As the primary medium for signal and power transmission, cable quality directly impacts equipment uptime and wafer yield. Traditional wrapped PI cables, limited by inherent structural flaws, suffer from drawbacks such as high vacuum outgassing, poor electrical stability, mechanical fragility, and insufficient temperature range coverage; they fail to meet high-end semiconductor process standards and pose hidden risks to the long-term stable operation of precision equipment.
With over two decades of expertise in specialty cables, TST CABLE has overcome the structural pain points of traditional wrapped cables by launching an integrated, seamless extruded PI cable. Leveraging a revolutionary manufacturing process to eliminate defects at the source, these cables are fully compatible with demanding applications—including semiconductor UHV chambers, cryogenic testing, and high-frequency precision signal transmission—making them a highly reliable choice for the domestic substitution of semiconductor equipment.
- Innovative Extrusion Process: Comprehensive Compatibility with Extreme Operating Conditions
TST CABLE’s extruded PI cables utilize a continuous, integrated extrusion process with molten PI raw material. This creates a seamless, dense, and homogeneous insulation layer over the conductor, structurally eliminating the defects associated with wrapping processes. All performance metrics have been verified by authoritative third-party testing.
Ultra-low Outgassing: Suitable for Ultra-High Vacuum (UHV) Chambers
Free from plasticizers, additives, and standard colorants, the entire product line complies with ASTM E595 standards: standard UHV cables achieve TML < 1% and CVCM < 0.1%, while cryogenic UHV cables achieve TML < 0.8% and CVCM < 0.10%. No harmful substances are released during high-temperature baking at 250°C. The product is capable of long-term operation in ultra-high vacuum environments (10⁻⁷ to 10⁻¹² mbar), meeting cabling standards for photolithography, etching, and thin-film deposition equipment.
Excellent electrical performance ensuring high-frequency signal transmission
With an insulation resistance of ≥1×10¹⁶ Ω·cm and a pinhole-free insulation layer, the cable offers outstanding voltage withstand and electromagnetic interference (EMI) resistance. Its seamless structure effectively eliminates electric field distortion; partial discharge performance is vastly superior to traditional wrapped cables, eliminating discharge risks under high-frequency pulse conditions. Rated voltages include 300V, 600V, and 1000V, accommodating both low-voltage control and medium-voltage power transmission within the equipment.
Ultra-wide temperature range and thermal cycling resistance
Standard extruded PI cables operate continuously between -269°C (liquid helium) and 260°C, with short-term temperature resistance up to 300°C; a specialized ultra-low temperature/ultra-high vacuum variant withstands up to 400°C, making it suitable for both cryogenic testing and high-temperature chamber environments. The cables withstand repeated thermal shocks from room temperature to the liquid helium range without insulation cracking or delamination, making them ideal for various cryogenic processes and thermal cycling tests.
Superior mechanical strength and ease of routing in tight spaces
With an abrasion resistance of ≥20,000 cycles, the product withstands conditions such as internal cable routing and continuous vibration. Compared to traditional wrapped cables, the outer diameter is reduced by 5%–10% and overall weight by 15%, effectively saving internal equipment space. The insulation layer bonds to the conductor at the molecular level—withstanding 25% elongation without separation or cracking—and the entire series features specific bend radii to meet compact routing requirements.
Radiation resistance and strong chemical stability
Capable of withstanding a radiation dose of 10⁹ rad, the cables are suitable for high-radiation environments such as radiation inspection and particle accelerators. They exhibit excellent chemical inertness—resisting acids, alkalis, and organic solvents—and do not react with semiconductor process gases, ensuring stable, non-degrading performance during long-term use. 2. Scenario-Specific Selection Guide
- Ultra-High Vacuum (UHV) Chamber Cabling (Etching / Deposition / Lithography)
Recommended Models: TST-UHV-S/J/D Series
Applicable Conditions: 10⁻⁹–10⁻¹² mbar vacuum environment; withstands 200°C bake-out.
Selection Advice: Use TST-UHV-S (single conductor) for fixed wiring; the unshielded design further minimizes outgassing. Use TST-UHV-J (stranded conductor) for dynamic/flexible wiring. Use TST-UHV-D (multi-core with low-outgassing shielded jacket) for control circuits. The entire series complies with ASTM E595 testing standards.
- Cryogenic Testing and Superconducting Equipment (4K–77K)
4K Liquid Helium + High Voltage: Select TST-GYPIT (4K polyimide high-voltage cable for liquid helium environments); compatible with DC 15/20/30kV.
77K Liquid Nitrogen Signal Transmission: Select TST-SDJPI-DYT (77K polyimide cable for liquid nitrogen); low-noise characteristics suit cryogenic sensors.
Combined Cryogenic + UHV Conditions: Select TH/J-PIPIP-DYT (polyimide cable for cryogenic UHV); pairing with silver-plated conductors (silver layer thickness ≥5μm) is recommended to enhance low-temperature conductivity stability.
- High-Frequency Signals and Precision Detection (Probe Stations / Metrology Equipment)
Recommended Model: TST-CP/P UHV Coaxial Cable
Applicable Conditions: 50Ω standard impedance, low dielectric loss, high interference resistance.
Selection Advice: Features stranded silver-plated copper conductors and dense polyimide (PI) insulation with >90% shielding coverage; ensures stable transmission of high-frequency and precision detection signals within confined vacuum spaces. 4. High-Temperature Chamber and Power Connections (Diffusion Furnaces / Oxidation Furnaces)
Recommended Models: TST-PI (Radiation- and high-temperature-resistant PI cable); TST-PEEK (Radiation-resistant PEEK cable)
Suitable Conditions: Long-term high-temperature exposure, aging resistance, and radiation resistance.
Selection Advice: TST-PI cables withstand temperatures from 4K to 300°C and come in a full range of voltage specifications, making them compatible with mainstream high-temperature power and signal circuits. TST-PEEK cables operate between -65°C and 250°C, offering outstanding insulation performance suitable for combined high-vacuum and high-temperature environments.
Selection Pitfalls to Avoid: Verify these three core parameters.
TIPS
Vacuum Outgassing: Check ASTM E595 test reports; distinguish specific product parameters rather than relying on vague “low outgassing” marketing claims.
Partial Discharge Performance: For high-frequency, high-voltage scenarios, verify measured PDIV data; leverage seamless structural advantages to mitigate discharge risks.
Conductor Material & Plating: Use silver-plated copper or oxygen-free copper for standard conditions. For cryogenic scenarios (e.g., liquid helium at -269°C), silver-plated conductors with a plating thickness of ≥5μm are mandatory to prevent oxidation and volatilization.
When selecting cables for semiconductor equipment, compatibility is far more critical than mere product positioning. TST CABLE’s extruded PI cables—featuring a mature seamless extrusion process, traceable test data, and stable performance across the entire temperature range—provide targeted solutions for challenges such as ultra-high vacuum, cryogenic temperatures, and high-frequency signal transmission.
Whether for replacement parts in imported equipment, OEM integration for new machines, or custom solutions for specialized processes, we offer both standard cables and personalized, comprehensive solutions. Our reliable products ensure the efficient operation of semiconductor equipment and safeguard wafer yield rates.
▶ For immediate selection assistance or inquiries, please contact TST CABLE through official channels to receive a tailored cable solution designed specifically for high-vacuum environments.
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